ZU19/ZU17/ZU11- Zynq UltraScale+ SOM

ZU19/ZU17/ZU11- Zynq UltraScale+ SOM

iW-RainboW-G35M®

  • Xilinx’s Zynq Ultrascale+ MPSoC family with FFVC1760 package
  • Compatible with ZU19/ZU17/ZU11 EG device
  • Maximum Memory Bandwidth:
    • 64bit, 8GB PS DDR4 RAM with ECC
    • 128bit, 16GB PL DDR4 RAM
  • Up to 1143K Logic cells & 522K LUTs
  • Two High Density Connectors:
    • 16 GTY Transceivers (32.75Gbps) & 16 GTH Transceivers (16.3Gbps)
  • Two 240pin High Speed Connectors:
    • 16 GTH Transceivers (16.3Gbps), 4 GTR Transceivers (6Gbps) & 142 user IOs
  • Optional On-SOM MAX10 FPGA
  • Industrial grade availability
  • 10+ Years Longevity

On Module Features:

  • ZU19/ZU17/ZU11 – Zynq Ultrascale+ MPSoC
    • Processing System (PS)
      • Quad/Dual Arm Cortex-A53 @1.5GHz, Dual Cortex-R5 @600MHz
      • Arm Mali-400MP2 GPU @677MHz
    • Programming Logic (PL)
      • Up to 1143K Logic cells & 522K LUTs
      • PL GTH High Speed Transceivers x 16 @16.3 Gbps
  • 64bit, 4GB DDR4 RAM with ECC for PS (Upgradable upto 8GB)
  • Dual 64bit, 4GB DDR4 RAM for PL (Upgradable upto 16GB)
  • 8GB eMMC Flash (Upto 128GB)
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

 

 

Two High Density Board to Board Connectors Interfaces:

  • PL-GTY High Speed Transceivers (upto 32.75Gbps) x 16
  • PL-GTH High Speed Transceivers (upto 16.3Gbps) x 16

Two 240pin High Speed Board to Board Connectors Interfaces:

From PS Block

  • PS-GTR High Speed Transceivers (upto 6Gbps) x 4
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • RGMII Interface or ULPI Interface x 1
  • SD (4bit) x 1
  • SPI x 1
  • CAN x 2
  • Debug UART x 1
  • Data UART x 1
  • I2C x 2
  • PS JTAG

From PL Block

  • PL-GTH High Speed Transceivers (upto 16.3Gbps) x 16
  • PL IOs – 142 IOs
    • HP Bank IOs – Upto 48 LVDS IOs/96 Single ended (SE)
    • HD Bank IOs – Upto 23 LVDS IOs/46 Single ended (SE)
    • GC Global Clock Input pins – Upto 15 LVDS/SE
    • ADC Input pins – Upto 16 Differential/Single Ended

 

 

 

OS Support

  • Linux BSP – Petalinux 2023.2
  • Baremetal BSP – Vivado 2020.1

General Features:

Power Input

5V through B2B Connector2

Operating Temperature

-40°C to +85°C (Industrial)

Form Factor

75mm x 110mm

Environment Specification

RoHS & REACH Compliant

Compliance

CE*

* Under Progress

DEVELOPMENT KIT

ZU19/ZU17/ZU11 Zynq UltraScale+ SOM Dev Kit
  • 100G Ethernet though QSFP28/QSFP+ Connector
  • 112G FireFly Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP 1.2a Display Port Connector
  • PCIe Gen2 x4 & M.2 SATA 3.1 Connector
  • USB 3.0 OTG through TypeC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD & Dual PMOD Connector
  • CAN Header & 20 Pin Header (for PS IOs)
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for ZU19/17/11EG Zynq UltraScale+ MPSoC SOM.

PCIe Gen3 X8 FMC MODULE

iWave supports FMC Module for Zynq MPSoC Development Kit with PCIe Gen3 x8 Rootport/Endpoint Slot, M.2 PCIe (2lane) NVMe Connector, MIPI CSI Connector and MIPI DSI Connector..

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