Zynq 7000 SODIMM SOM

On Module Features:

Compatible Zynq 7000 SoC – 7007S, Z-7014S, Z-7010, Z-7020
- Single/Dual Arm Cortex-A9 @866MHz
- Up to 85K Logic cells
512MB DDR3 RAM expandable up to 1GB
8GB eMMC Flash (Upgradable)
Micro SD (Optional)
2MB QSPI Boot Flash
RGMII Ethernet PHY Transceiver
USB2.0 ULPI Transceiver
WiFi & BT Combo Module

SODIMM Edge Connector Interfaces:

From PS Block	Gigabit Ethernet x 1 USB2.0 OTG x 1 Debug UART x 1 I2C x 1 JTAG SD (4bit) x 1 (Optional)
From PL Block	60LVDS/120SE FPGA IOs Up to 10 Clock Capable LVDS/SE pins Up to 16 12bit 1Mbps Analog Input channels

From PS Block

Gigabit Ethernet x 1
USB2.0 OTG x 1
Debug UART x 1
I2C x 1
JTAG
SD (4bit) x 1 (Optional)

From PL Block

60LVDS/120SE FPGA IOs

Up to 10 Clock Capable LVDS/SE pins
Up to 16 12bit 1Mbps Analog Input channels

General Features:

Power Input	3.3V through SODIMM Edge
Operating Temperature	-40°C to +85°C
Form Factor	67.6mm x 37mm
BSP Support	Linux BSP:- Petalinux/Vivado 2020.2
Environment Specification	RoHS & REACH Compliant
Compliance	CE*

* Under Progress

DEVELOPMENT KIT

Gigabit Ethernet through RJ45MagJack
USB2.0 OTG through MicroAB Connector
Standard SD Connector
FMC High Pin Count (HPC) Connector with Upto 98 Single ended (SE) IOs/39 LVDS IOs
Dual PMOD Connector
JTAG Connector
Debug UART through USB MicroAB Connector
RTC Coin Cell Holder
Operating Temperature: -20°C to +85°C
Form Factor : 100mm x 72mm

Need help with your FPGA and Product Design?

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for Zynq7000 SOM.

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards/SBC

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

Zynq 7000 SODIMM SOM

On Module Features:

SODIMM Edge Connector Interfaces:

General Features:

DEVELOPMENT KIT

Need help with your FPGA and Product Design?

THERMAL SOLUTIONS

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