ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR – Zynq UltraScale+ RFSoC SOM

iW-RainboW-G60M^®

Zynq Ultrascale+ RFSoC family with FFVG1517 Package
Compatible with 48/47/43/28/27/25DR device
Integrated SD-FEC Block
Integrated ultra low-noise programmable RF PLL
Integrated SyncE & PTP Network Synchronization
Dual 400 Pin Board to Board connectors
Industrial Grade Availability
10+ Years Longevity Support

Categories: FPGA Modules, System On Modules

On Module Features:

48/47/43/28/27/25DR – Zynq Ultrascale+ RFSoC	Processing System (PS) Quad Arm Cortex-A53 @1.3GHz, Dual Cortex-R5F @533MHz Programming Logic (PL) Up to 930 Logic cells & 425K LUTs PL GTY High Speed Transceivers x 16 @28.21 Gbps
Memory	64bit, 8GB DDR4 RAM with ECC for PS 64bit, 8GB DDR4 RAM for PL 32GB eMMC Flash (Upgradable) 256MB QSPI Flash RGMII Ethernet PHY Transceiver USB2.0 ULPI Transceiver

Board to Board Connector1 Interfaces (400pin):

PL IOs	PL IOs – 164 IOs HP Bank IOs – up to 70LVDS/140SE HD Bank IOs – up to 12LVDS/24SE
ADC	8 x ADC Channels up to 5Gsps
DAC	8 x DAC Channels up to 9.85Gsps

PL IOs

PL IOs – 164 IOs

HP Bank IOs – up to 70LVDS/140SE
HD Bank IOs – up to 12LVDS/24SE

ADC

8 x ADC Channels up to 5Gsps

DAC

8 x DAC Channels up to 9.85Gsps

Board to Board Connector2 Interfaces (400pin):

From PL Block	16 x PL-GTY High Speed Transceivers (up to 28.21Gbps) PL Control Signal
From PS Block	Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY) USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver) SPI/QSPI X 1 Port(Optional) CAN x 1 I2C x 2 SD x 1 Debug UART x 1 Data UART x 1 PS JTAG RGMII Interface or ULPI Interface x 1 PS -GTR High speed Transceivers x 4 (upto 6Gbps) PS-Control Signals SYSMON(Optional)
Clock signals	10MHz Clock IN 1 PPS IN 10 MHz Clock out 1 PPS Clock Out Synthesized Clock out from Clock synthesizer Synthesized Clock Into Clock Synthesizer

General Features:

Power Input	12V through B2B Connector2
Form Factor	82mm x 100mm(BRYN)
BSP Support	Linux BSP:- Petalinux/vivado 2022.2
Operating Temperature	-40°C to +85°C (Industrial)
Environment Specification	RoHS & REACH Compliant
Compliance	CE*

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for RFSoC based SOM.

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR – Zynq UltraScale+ RFSoC SOM

ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR – Zynq UltraScale+ RFSoC SOM

On Module Features:

Board to Board Connector1 Interfaces (400pin):

Board to Board Connector2 Interfaces (400pin):

General Features:

THERMAL SOLUTIONS

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