ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR – Zynq UltraScale+ RFSoC SOM

ZU48/ZU47/ZU43/ZU28/ZU27/ZU25DR – Zynq UltraScale+ RFSoC SOM

iW-RainboW-G60M®

  • Zynq Ultrascale+ RFSoC family with FFVG1517 Package
  • Compatible with 48/47/43/28/27/25DR device
  • Integrated SD-FEC Block
  • Integrated ultra low-noise programmable RF PLL
  • Integrated SyncE & PTP Network Synchronization
  • Dual 400 Pin Board to Board connectors
  • Industrial Grade Availability
  • 10+ Years Longevity Support

On Module Features:

48/47/43/28/27/25DR – Zynq Ultrascale+ RFSoC
  • Processing System (PS)
    • Quad Arm Cortex-A53 @1.3GHz,
    • Dual Cortex-R5F @533MHz
  • Programming Logic (PL)
    • Up to 930 Logic cells & 425K LUTs
    • PL GTY High Speed Transceivers x 16 @28.21 Gbps
Memory
  • 64bit, 8GB DDR4 RAM with ECC for PS
  • 64bit, 8GB DDR4 RAM for PL
  • 32GB eMMC Flash (Upgradable)
  • 256MB QSPI Flash
  • RGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

Board to Board Connector1 Interfaces (400pin):

PL IOs

PL IOs – 164 IOs

  • HP Bank IOs – up to 70LVDS/140SE
  • HD Bank IOs – up to 12LVDS/24SE
ADC

8 x ADC Channels up to 5Gsps

DAC

8 x DAC Channels up to 9.85Gsps

Board to Board Connector2 Interfaces (400pin):

From PL Block
  • 16 x PL-GTY High Speed Transceivers (up to 28.21Gbps)
  • PL Control Signal
From PS Block
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • SPI/QSPI X 1 Port(Optional)
  • CAN x 1
  • I2C x 2
  • SD x 1
  • Debug UART x 1
  • Data UART x 1
  • PS JTAG
  • RGMII Interface or ULPI Interface x 1
  • PS -GTR High speed Transceivers x 4 (upto 6Gbps)
  • PS-Control Signals
  • SYSMON(Optional)
Clock signals
  • 10MHz Clock IN
  • 1 PPS IN
  • 10 MHz Clock out
  • 1 PPS Clock Out
  • Synthesized Clock out from Clock synthesizer
  • Synthesized Clock Into Clock Synthesizer

General Features:

Power Input

12V through B2B Connector2

Form Factor

82mm x 100mm(BRYN)

BSP Support

Linux BSP:- Petalinux/vivado 2022.2

Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

RoHS & REACH Compliant

Compliance

CE*

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for RFSoC based SOM.

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