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Design Support

Software

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TI DR821Ux SBC Top View image

TI DRA821Ux Based SBC

TI DRA821Ux Based SBC

iW-RainboW-G59S®

  • DRA821Ux with 64-bit Dual Arm Cortex-A72
  • 4× Arm Cortex-R5F Subsystem
  • 2GB LPDDR4 Expandable up to 8GB and 16GB eMMC Flash
  • 1000/100/10 Mbps Ethernet x2
  • Supports Super Speed USB 3.0
  • Industrial/Automotive grade Availability
  • 10+ years long term support
Categories: ,

On Module Feature

CPU
  • DRA821U2: Dual Cortex-A72, x4 Cortex-R5F, upto 2 CPSW5G Ethernet port
  • DRA821U4: Dual Cortex-A72, x4 Cortex-R5F, upto 4 CPSW5G Ethernet port
Memory
  • 2GB LPDDR4 expandable up to 8GB
  • 16GB eMMC Flash
  • 2KB EEPROM
  • Micro SD slot
Network & Communication
  • Gigabit Ethernet PHY Transceiver with RJ45 MagJack Connector x2
  • USB 3.0 through Type-A stacked connector
  • USB 2.0 through Micro AB connector
Other Interfaces
  • Supports Audio IN/OUT through 3.5mm Audio Jack
  • CAN Interface through CAN Header x1
  • Supports Data UART through RS232 Header x1
  • Debug UART Header
Miscellaneous Interface
  • JTAG Header
  • RTC Battery Header
  • FAN Header
Expansion Connector
  • ADC x2
  • GPIOs x10

OS Support

  • Linux

General Features

Power Input

12V through Power Jack

Form Factor

Pico-ITX SBC (100mm x 72mm)

Operating Temperature

-40°C to +85°C

Environment Specification

REACH & RoHS3 Compliant

TI DRA821Ux Based OSM

TI DRA821Ux -TOP view image
TI DR821Ux OSM bottom
TI DR821Ux OSM Side image
  • DRA821Ux with 64-Bit
  • Dual Arm Cortex-A72
  • 4× Arm Cortex-R5F Subsystem
  • 2GB LPDDR4 Expandable up to 8GB and
  • 16GB eMMC Flash Expandable up to 128GB
  • Supports High speed Interface such as PCIe,
  • SGMII, USB3.0
  • OSM v1.1 Size-MF LGA Solderable Module
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