ZU5/ZU4/ZU3/ZU2 – Zynq UltraScale+ MPSoC SBC

ZU5/ZU4/ZU3/ZU2 – Zynq UltraScale+ MPSoC SBC

iW-RainboW-G36S®

  • ZU5/ZU4/ZU3/ZU2 Zynq Ultrascale+ MPSoC with SFVC784 package
  • 64bit, 8GB PS DDR4 & 32bit, 4GB PL DDR4
  • 4K HDMI Input & Output Ports and Display Port
  • One 10G Ethernet &Dual 1G Ethernet
  • 11 a/b/g/n/ac Wi-Fi & BT 5.0
  • Three 80pin Connector with120 PL & 10 PS User IOs
  • 12G SDI Video Input & Output Ports (Optional)
  • Industrial grade availability
  • Compact form factor 100mm x 72mm
  • 10+ Years availability

ZU5/ZU4/ZU3/ZU2 - Zynq Ultrascale+ MPSoC

  • Processing System (PS)
    • Quad/Dual ARM Cortex-A53 @ 1.5GHz, Dual Cortex-R5 @ 600MHz
    • 264/H.265 Video Encoder/Decoder (VCU)
    • ARM Mali-400MP2 GPU @ 677MHz
  • Programming Logic (PL)
    • Up to 256K Logic cells

Memory Interfaces

  • 64bit, 2GB DDR4 with ECC for PS (Upgradable upto 8GB)
  • 32bit, 1GB DDR4 for PL (Upgradable upto 4GB)
  • 8GB eMMC Flash (Upgradable)
  • Micro SD Connector#
  • EEPROM for MAC Address

Features from PS

  • WLAN 802.11a/b/g/n/ac& BT 5.0 Combo Module with Antenna connector
  • Dual 10/100/1000Mbps Ethernet through RJ45 Magjack
  • Dual USB3.0 Type A Jack
  • DP 1.2a Display Port Connector
  • 2 Key B Connector with SATA 3.1& USB3.0
  • Debug UART Header
  • JTAG Header
  • RTC Coin cell Header

Features from PL GTH Transceivers*

  • 4K HDMI 2.0 Output Connector
  • 4K HDMI 2.0 Input Connector
  • 10G Ethernet through SFP+ Connector
  • 12G SDI Input through BNC Jack#
  • 12G SDI Output through BNC Jack#

Board to Board Connectors

PS Interfaces

SPI x 1
CAN x 2
I2C x 1
UART x 1#

PL Interfaces

FPGA IOs from HP Bank – 20LVDS/40SE
FPGA IOs from HD Bank – 41LVDS/82SE

OS Support

  • Linux BSP – Petalinux 2022.2
  • Baremetal BSP – Vivado 2020.1

General Features:

Power Input

12V through Power Jack

Operating Temperature

-40°C to +85°C

Form Factor

100mm x 72mm

BSP Support

Linux 5.4/Vivado2021.1

Environment Specification

RoHS & REACH Compliant

Compliance

CE*

#Optional
* PL GTH Transceivers are not supported in ZU3 & ZU2 MPSoC
*Under Progress

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

ENCLOSURE

iWave supports rugged aesthetic Aluminium and Metal sheet enclosures for the SBC which serves dual purpose as Heat sink and also as enclosure whilst maintaining fullaccess to all the major ports.

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