i.MX 93 SODIMM SOM

On Module Feature:

CPU	i.MX 9352: 2x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM i.MX 9351: 1 x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM i.MX 9332: 2x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM i.MX 9331: 1x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
Memory & Storage	LPDDR4X – 2GB eMMC Flash – 16GB (Expandable)

CPU

i.MX 9352: 2x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
i.MX 9351: 1 x Cortex®-A55, NPU, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
i.MX 9332: 2x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM
i.MX 9331: 1x Cortex®-A55, MIPI DSI, LVDS, MIPI CSI, Parallel camera, Parallel display, 2x Ethernet, 2x USB 2.0, 7x I2S TDM

Memory & Storage

LPDDR4X – 2GB
eMMC Flash – 16GB (Expandable)

Other On-SOM Features

IEEE 802.11a/b/g/n/ac/ax+ Bluetooth 5.3+ IEEE802.15.4 (Optional)
Gigabit Ethernet PHY Transceiver x 1
EEPROM
RTC Controller
TPM module (Optional)

SODIMM PCB Edge Interfaces

Gigabit Ethernet x 1
LVDS x 1
MIPI DSI (4 Lane) x 1
MIPI CSI (2 Lane) x 1
SD (4bit) x 1
USB 2.0 OTG x 1
USB 2.0 Host x 1
SAI (Audio Interface) x 1
Debug UART
Data UART (without CTS & RTS) x 1
PWM x 2
CAN x 2
JTAG
GPIOs
I2C
SPI
RGB 24 bit (Optional)
QOS RGMII signals (Optional)
Tamper x 2(Optional)
CLKIN x 2(Optional)
ADC x 4(Optional)

OS Support:

Linux 6.1.22

General Features:

Power Input	3.3V, 2A Input from SODIMM Edge Connector
Form Factor	67.6mm x 37mm
Operating Temperature	-40°C to +85°C (Industrial Grade)

DEVELOPMENT KIT

Debug UART through USB Micro AB Connector
DATA UART x 1 Port through Header
10/100/1000 Mbps Ethernet through RJ45-MagJack-1
USB 2.0 OTG as a device x 1 Port through Micro AB Connector
USB 2.0 Host x 2 Ports through USB Type-A Connector
SD x 1 Port through Micro SD Connector
CAN Module
I2S Audio Codec with 3.5mm Audio IN/OUT jack

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for i.MX 93 SODIMM SOM.

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

i.MX 93 SODIMM SOM

On Module Feature:

Other On-SOM Features

SODIMM PCB Edge Interfaces

OS Support:

General Features:

DEVELOPMENT KIT

THERMAL SOLUTIONS

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