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On Module Feature:
| CPU | i.MX 9352: 2 x Cortex-A55, NPU |
|---|---|
| Memory & Storage | 2GB LPDDR4/4X(By default, LPDDR4X is supported) |
| Other | Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 |
OSM LGA Features:
|
OS Support:
|
General Features:
| Power Input | 5V, 2.5A through OSM BGA |
|---|---|
| Form Factor | 45mm x 45mm (Size L) |
| Operating Temperature | -40°C to +85°C (Industrial) |
| Environment Specification | REACH & RoHS3 Compliant |
OSM Based Pico ITX SBC
- Dual 1000/100/10 Mbps Ethernet
- CAN Header x 1
- USB 2.0 OTG (micro AB Receptacle Connector) x 1
- Dual USB 2.0 Host (TypeA) x 1
- Micro SD
- 4 Lane MIPI DSI Display Connector
- 2 Lane MIPI DSI Display Connector (Optional)
- 4 Lane LVDS Display Connector
- MIPI CSI Camera Connector
- Debug UART Header x 1
- 3.5mm Audio In & Out Jack through I2S Codec x 1
- GNSS receiver Module –GPS/GLONASS/Galileo/BeiDo (Optional)
- M.2 Connector Key B/M (Key M is optional)
- USB Touch Header x 1
- LINE IN & OUT Speaker Headers
- RS232 Header x 1
THERMAL SOLUTIONS
For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX93 OSM LGA Module.
For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX93 OSM LGA Module.
ENCLOSURE
The Enclosure is essential for an SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.
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i.MX 93 OSM System on Module
System on Module
Development Kit
System on Module
Development Kit
iWave is an embedded systems engineering and solutions company, designing solutions for the Industrial, Medical, Automotive and Avionics vertical markets, and building on our core competency of embedded expertise since 1999. Read More…
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