i.MX 91 OSM-LF LGA Module

i.MX 91 OSM-LF LGA Module

iW-RainboW-G50M®

  • i.MX 91 CPU with 64-bit ARM v8.2-A Architecture
  • 2GB LPDDR4 Memory
  • 16GB eMMC Flash(Expandable)
  • Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 Connectivity
  • Supports 1 x Cortex-A55 cores
  • Supports 2 × 1Gbps Ethernet (1 with TSN)
  • 10+ years of Product Longevity Program
  • OSM v1.1 Size-L LGA Solderable Module

On Module Feature:

CPU

1 x Cortex-A55@1.4 GHz

Memory & Storage

LPDDR4 – 2GB
eMMC Flash – 16GB (Expandable)

Other

Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4
1:4 USB2.0 HUB
External RTC Controller
Programming Header

OSM LGA Features:

  • RGMII x 2
  • SD(4bit) x 1
  • USB 2.0 OTG x 1
  • USB 2.0 HOST x 4
  • CAN x 2
  • UART x 3 (1 is optional)
  • Debug UART x 1
  • I2S x 1
  • SPI x 1
  • I2C x 2
  • PWM x 1
  • JTAG x 1
  • GPIOs

OS Support:

  • Linux 6.1.22

General Features:

Power Input

5V, 2.5A through OSM BGA

Form Factor

45mm x 45mm (Size L)

Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

REACH & RoHS3 Compliant

OSM BASED PICO ITX SBC

  • Dual 1000/100/10 Mbps Ethernet
  • CAN Header x 1
  • USB 2.0 OTG (micro AB Receptacle Connector) x 1
  • Dual USB 2.0 Host (TypeA) x 1
  • Micro SD
  • Debug UART Header x 1
  • 3.5mm Audio In & Out Jack through I2S Codec x 1
  • GNSS receiver Module – GPS/GLONASS/Galileo/BeiDo
  • M.2 Connector Key B/M (Key M is optional)
  • USB Touch Header x 1
  • LINE IN & OUT Speaker Headers
  • RS232 Header x 1

THERMAL SOLUTIONS

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX91 OSM LGA Module.

ENCLOSURE

The Enclosure is essential for an SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

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