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CPU | 1 x Cortex-A55@1.4 GHz |
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Memory & Storage | LPDDR4 – 2GB |
Other | Wi-Fi 6, Bluetooth 5.3 & IEEE802.15.4 |
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Power Input | 5V, 2.5A through OSM BGA |
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Form Factor | 45mm x 45mm (Size L) |
Operating Temperature | -40°C to +85°C (Industrial) |
Environment Specification | REACH & RoHS3 Compliant |
For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX91 OSM LGA Module.
The Enclosure is essential for an SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.
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iWave is an embedded systems engineering and solutions company, designing solutions for the Industrial, Medical, Automotive and Avionics vertical markets, and building on our core competency of embedded expertise since 1999. Read More…
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