i.MX 8M Plus OSM-LF LGA Module

iW-RainboW-G40M^®

i.MX 8M Plus Q/QL/D CPU with 64-bit ARMv8 Architecture
NPU with up to 2.3 TOP/s Neural Network performance
2GB LPDDR4 expandable up to 8GB
16GB eMMC Flash expandable up to 256GB
IEEE 802.11a/b/g/n/ac/ax Wi-Fi & Bluetooth 5.0 (ax is optional)
10+ years of Product Longevity Program
Excels in ML vision, edge intelligence & advanced multimedia applications
OSM v1.0, Size-L Solderable Module

Categories: System On Modules, SODIMM Modules

On Module Feature:

CPU	i.MX 8M Plus Quad : 4 x Cortex-A53, 1 x Cortex-M7, GPU, VPU, NPU ,ISP & HiFi4 Audio DSP i.MX 8M Plus Quad Lite : 4 x Cortex-A53, 1 x Cortex-M7 & GPU i.MX 8M Plus Dual : 2 x Cortex-A53, 1 x Cortex-M7, GPU, VPU, NPU ,ISP & HiFi4 Audio DSP
Memory & Storage	2GB LPDDR4 expandable up to 8GB 16GB eMMC Flash expandable up to 256GB
Other	IEEE 802.11 a/b/g/n/ac/ax Wi-Fi & BT 5.0 (ax is optional)

OSM LGA Features:

RGMII X 2
USB 3.0 x 2
USB 2.0 x 2
PCIe 3.0 x 1
SDIO x 2 (4 bit x 1, 8 bit x 1** )
HDMI 2.0a TX x 1
SPI x 2
CAN x 2
I2C x 2
OSM GPIOs
4 lane MIPI DSI x 1
4 lane MIPI CSI X 1*
4 lane MIPI CSI x 1
4 lane LVDS x 2
I2S x 1
UART x 4 ( 1 is optional)
PWM x 1

OS Support:

Linux 6.1.22 (or higher)
Android 12 (or higher)
Ubuntu 22.04 (or higher)

General Features:

Power Input	5V, 2.5A through OSM LGA
Form Factor	45mm x 45mm (Size L)
Operating Temperature	-40°C to +85°C (Industrial)
Environment Specification	REACH & RoHS3 Compliant

Note: Optional features are not supported in default configuration, *4 lane MIPI CSI X 1 is Optionally available through vendor defined pins, **Optional feature

OSM Based Pico ITX SBC

Gigabit Ethernet Jack x 2
GNSS receiver Module -GPS/GLONASS/Galileo/BeiDou(Optional)
USB 2.0 OTG (micro AB Receptacle Connector)
USB 3.0 Host Type-A x 2
Micro SD & HDMI TX x 1
4 Lane MIPI DSI display connector
2 Lane MIPI DSI Display (Optional)
4 Lane LVDS & MIPI CSI Camera Connector
Audio In & Out Jack through I2S Codec x1
Full function UART – 1 Port
RTC with a backup battery
CAN Header x 1 & M.2 Connector Key B/M (Key M is optional)
Type C OTG, 8 bit SD (Optional)
Type C PD Power (Optional)
Fan header

THERMAL SOLUTIONS

For any highly integrated OSM Modules, thermal design is a very important factor. iWave Supports Heat Sink and heat spreader Solution for i.MX 8M Plus OSM LGA Module

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

i.MX 8M Plus OSM-LF LGA Module

i.MX 8M Plus OSM-LF LGA Module

On Module Feature:

OSM LGA Features:

OS Support:

General Features:

OSM Based Pico ITX SBC

THERMAL SOLUTIONS

Related products

i.MX 8M Plus Pico ITX SBC

i.MX 8M Plus SMARC SOM

i.MX 8XLite OSM – SE LGA Module

i.MX 91 OSM-LF LGA Module

i.MX 91 Pico ITX SBC

i.MX 93 OSM System on Module

i.MX 93 Pico ITX SBC

RELATED VIDEOS

Related products

i.MX 8XLite OSM – SE LGA Module

i.MX 93 OSM System on Module

i.MX 91 Pico ITX SBC

i.MX 93 Pico ITX SBC

i.MX 8M Plus Pico ITX SBC

i.MX 91 OSM-LF LGA Module

i.MX 8M Plus SMARC SOM

Related News

Custom i.MX Powered Boards and Solutions in just 8 Weeks

DVFS Support for a wide range of CPU Frequencies on the i.MX 8M Plus System on Module

The Need for Thermal Management in Embedded Boards and Solutions

OSM Solderable System on Module and its Advantages

Explaining Open Standard Module (OSM): The Standard for System on Modules

iWave Systems launches i.MX 8M Plus Open Standard Module: A Solderable System-On-Module

Subscribe to iWave Newsletter