Arria 10 SoC FPGA SOM

On Module Feature:

Compatible Arria10 SoC Family – SX270, SX320, SX480, SX570, SX660
- Dual Core ARM Cortex A9 @ upto 1.5 GHz/Core Hard Processor System
- Up to 660K Logic elements
- High Speed Transceivers x 24 @ 17.4 Gbps

Compatible Arria10 FPGA Family – GX270, GX320, GX480, GX570, GX660, GX900, GX1150
- Up to 1150K Logic elements
- High Speed Transceivers x 24 @ 17.4 Gbps
32bit, 2GB DDR4 RAM with ECC for HPS(Upgradable upto 4GB)
64bit,4GB DDR4 RAM for FPGA(Upgradable upto 8GB)
8GB eMMC Flash(Upgradable)
RGMII Ethernet PHYTransceiver
ULPI Transceiver

Two 240pin High Speed Board to Board Connectors Interfaces

From HPS Block	Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY) USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver) SPI x 1 Debug UART x 1 I2C x 1 GPIOs x 14
From FPGA Block	FPGA High Speed Transceivers (upto17.4Gbps) x 24 FPGA IOs 91 LVDS IOs/189 Single ended (SE) 7 General Purpose Clock Input LVDS Pair/Single Ended 8 General Purpose Clock Output LVDS Pair/Single Ended

From HPS Block

Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
SPI x 1
Debug UART x 1
I2C x 1
GPIOs x 14

From FPGA Block

FPGA High Speed Transceivers (upto17.4Gbps) x 24

FPGA IOs

91 LVDS IOs/189 Single ended (SE)
7 General Purpose Clock Input LVDS Pair/Single Ended
8 General Purpose Clock Output LVDS Pair/Single Ended

General Features:

Power Input	5V through B2B Connector
Operating Temperature	-40°C to +85°C
Form Factor	75mm x 95mm
BSP Support	Linux BSP:- Linux 5.4/Quartus 21.3
Environment Specification	RoHS &REACH Compliant
Compliance	CE*

DEVELOPMENT KIT – DUAL FMC

10G Ethernet through SFP+ Connector
PCIe Gen3 x 1 Connector
Dual FMC High Pin Count (HPC) Connector
Gigabit Ethernet through RJ45MagJack
USB2.0 OTG through MicroAB Connector
Dual PMOD Connector
20 Pin Header (for PS IOs)
Debug UART through USB MicroAB Connector
RTC Coin Cell Holder
Operating Temperature: -20°C to +85°C
Form Factor: 130mm x 140mm

DEVELOPMENT KIT – FMC+

VITA 57.4 FMC+ High Pin Count (HPC) Connector
PCIe Gen3 x4 Connector
NVMe M.2 Connector x 1 (PCIe x4)
HDMI 1.4a Output
Gigabit Etherne through RJ45MagJack
USB2.0 Host x 2 Ports through Dual Stack Type A Connector
12pin PMOD Host Port Connector x1
6pin PMOD Host Port Connector x1
On-Board USB-Blaster™ II Interface through MicroAB Connector
Debug UART through USB MicroAB Connector
RTC Coin Cell Holder
Form Factor: 150mm x 140mm

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for Arria10 SoC FPGA SOM.

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

Arria 10 SoC FPGA SOM

On Module Feature:

Two 240pin High Speed Board to Board Connectors Interfaces

General Features:

DEVELOPMENT KIT – DUAL FMC

DEVELOPMENT KIT – FMC+

Custom Design Sevices

THERMAL SOLUTIONS

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