Arria 10 FPGA SOM

iW-RainboW-G24M^®

Arria 10 FPGA device compatibility (GX270, GX320, GX480, GX570, GX660, GX900, GX1150)
With upto 1150K Logic Elements and 24 High Speed transceivers
4-GB DDR4 RAM (64bit) & 2-GB DDR4 RAM for FPGA
24 high-speed transceivers @ 17.4Gbps
48/96 LVDS from BANK 3B & 3C and 93 SE from BANK 2A & 3A
Dual 240 Pin Board to Board Connector
Variable IO voltage support from PMIC
Industrial Grade operation
10+ Years Longevity

Categories: FPGA Modules, System On Modules

On Module Feature:

Compatible Arria10 FPGA Family – GX270, GX320, GX480, GX570, GX660, GX900, GX1150
- Up to 1150K Logic elements
- High Speed Transceivers x 24 @ 17.4 Gbps
2-GB DDR4 RAM (32bit) from FPGA
4-GB DDR4 RAM (64bit) from FPGA (only in GX480 or higher family devices)
Configuration Flash for FPGA
Other On SOM features
- JTAG Header
- 5V-FAN Header
- FPGA AS Header
- FPGA Configuration Selection Switch

Two 240pin High Speed Board to Board Connectors Interfaces

From connector 1 interface	FPGA High Speed Transceivers (upto 17.4Gbps) x 16 FPGA IOs & General Purpose Clocks – Bank2A Up to 21 LVDS/46SE IOs One General Purpose Clock Input LVDS Pair/Single Ended Two General Purpose Clock Output LVDS Pairs/Single Ended FPGA IOs & General Purpose Clocks – Bank3A Up to 22 LVDS/47SE IOs Two General Purpose Clock Input LVDS Pairs/Single Ended Two General Purpose Clock Output LVDS Pairs/Single Ended
From connector 2 interface	Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY from Bank2L IOs) USB OTG x 1 Port (through On-SOM USB ULPI PHY from Bank2L IOs) Upto 20 Single-Ended IOs FPGA AS Interface (Optional) FPGA High-Speed Transceivers (up to 17.4Gbps) x 8 FPGA IOs & General Purpose Clocks – Bank3B Up to 24 LVDS IOs/48SE IOs Two General Purpose Clock Input LVDS Pairs/Single Ended Two General Purpose Clock Output LVDS Pairs/Single Ended FPGA IOs & General Purpose Clocks – Bank3C Up to 24 LVDS IOs/48SE IOs Two General Purpose Clock Input LVDS Pairs/Single Ended Two General Purpose Clock Output LVDS Pairs/Single Ended JTAG Interface

From connector 1 interface

FPGA High Speed Transceivers (upto 17.4Gbps) x 16
FPGA IOs & General Purpose Clocks – Bank2A

- Up to 21 LVDS/46SE IOs
- One General Purpose Clock Input LVDS Pair/Single Ended
- Two General Purpose Clock Output LVDS Pairs/Single Ended
FPGA IOs & General Purpose Clocks – Bank3A
- Up to 22 LVDS/47SE IOs
- Two General Purpose Clock Input LVDS Pairs/Single Ended
- Two General Purpose Clock Output LVDS Pairs/Single Ended

From connector 2 interface

Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY from Bank2L IOs)
USB OTG x 1 Port (through On-SOM USB ULPI PHY from Bank2L IOs)
Upto 20 Single-Ended IOs
FPGA AS Interface (Optional)
FPGA High-Speed Transceivers (up to 17.4Gbps) x 8
FPGA IOs & General Purpose Clocks – Bank3B
- Up to 24 LVDS IOs/48SE IOs
- Two General Purpose Clock Input LVDS Pairs/Single Ended
- Two General Purpose Clock Output LVDS Pairs/Single Ended
FPGA IOs & General Purpose Clocks – Bank3C
- Up to 24 LVDS IOs/48SE IOs
- Two General Purpose Clock Input LVDS Pairs/Single Ended
- Two General Purpose Clock Output LVDS Pairs/Single Ended
JTAG Interface

General Features:

Power Input	5V
Operating Temperature	-40°C to +85°C
Form Factor	75mm x 95mm
BSP Support	Linux BSP:- Linux 5.4/Quartus 21.3
Environment Specification	RoHS &REACH Compliant
Compliance	CE*

DEVELOPMENT KIT – DUAL FMC

Gigabit Ethernet through RJ45MagJack x 1
USB2.0 OTG through Micro AB connector x 1
Debug UART through USB Micro AB connector x 1
10G Ethernet through SFP+ Connector
PCIe Gen3 x 1 Connector
Dual PMOD Connector
Dual FMC High Pin Count (HPC) Connector
SDI Video IN through HD BNC Connector x 1
SDI Video Out through HD BNC Connector x 1
M.2 SATA Connector x 1
USB3.0 TypeC connector x 1
Display Port Connector x 1
Clock Synthesizer/Generator
16-Bit IO Expander
JTAG Connector x 1
20 Pin GPIO Header x 1
RTC Coin Cell Holder
Power ON/OFF DIP Switch x 1
Reset Push button Switch x 1
Power Supply : DC 12V, 5A Power Input Jack
Form Factor: 130mm x 140mm

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

Product Design Process

Certification & Qualification

Product Lifecycle Management

Mechanical Services

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for Arria10 SoC FPGA SOM.

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards

FMC Cards

Documents

Design Support

Application Notes

Software

Documents

Design Support

Application Notes

Software

Arria 10 FPGA SOM

Arria 10 FPGA SOM

On Module Feature:

Two 240pin High Speed Board to Board Connectors Interfaces

General Features:

DEVELOPMENT KIT – DUAL FMC

Custom Design Sevices

THERMAL SOLUTIONS

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