Agilex 7 R24C SoC FPGA SOM

Agilex 7 R24C SoC FPGA SOM

iW-RainboW-G51M®

  • Quad ARM Cortex A53 Processor
  • R24C Package With 2 x F-Tile
  • 32GB eMMC (Expandable)
  • 8GB DDR4 with ECC for HPS (64bit + 8bit)
  • 8GB DDR4 with ECC for FPGA (64bit + 8bit)
  • 2 x 144Mb QDR-IV For FPGA (18bit)
  • 32 x FGT transceivers up to 58Gbps
  • FPGA IOs(75LVDS/150SE)
  • 10+ Years long term support

On module Feature

Agilex 7 R24C SoC FPGA
  • Compatible Agilex 7-Series – Agilex AGF 006, AG 008, AGF 012, AGF 014, AGF 019, AGF 023, AGF 022, AGF 027
  • Hard Processing System (HPS)
    • Quad-core 64-bit Arm Cortex-A53 up to 1.50 GHz
  • Field Programmable Gate Array (FPGA)
    • Up to 2,692,760 Logic elements
    • 32 x FGT transceivers up to 58Gbps
  • 8GB DDR4 with ECC for HPS (64bit + 8bit)
  • 8GB DDR4 with ECC for FPGA (64bit + 8bit)
  • 2 x 144Mb QDR-IV For FPGA (18bit)
  • 32GB eMMC (Expandable)
  • SGMII Ethernet PHY Transceiver
  • USB2.0 ULPI Transceiver

Board to Board Connectors Interfaces

From HPS (Hard Processor System)
  • USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver)
  • RGMII x 1
  • Debug UART x 1
  • SD x 1 (Optional)
  • I2C x 1
  • Data UART x 1
From SDM (Secure Device Manager)
  • JTAG x 1
  • AS x 1 (Active Serial x4)
From HPS to FPGA
  • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY)
From FPGA
  • 32 x FGT transceivers up to 58Gbps
  • FPGA IOs (Up to 75LVDS/150SE)

General Features

Power Input

5V through B2B Connector

Operating Temperature

-40°C to +85°C

Form Factor

110mm X 75mm

BSP Support

Linux BSP for ARM Cortex CPU

Environment Specification

RoHS & REACH Compliant

DEVELOPMENT KIT

Agilex7_R24_Devkit_image
  • QSFP28/QSFP+ Connector
  • SFP+ Connector
  • 12G SDI Video IN through HD BNC Connector
  • 12G SDI Video OUT through HD BNC Connector
  • 4K HDMI 2.0 IN through HDMI Connector
  • 4K HDMI 2.0 OUT through HDMI Connector
  • FMC High Pin Count (HPC) Connector
  • FMC+ High Pin Count (HPC) Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through MicroAB Connector
  • Standard SD Connector (Optional)
  • 20 Pin Header (for HPS IOs)
  • Dual PMOD Connector
  • RTC Coil Cell holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 140mm x 170mm

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Agilex R24C SoC FPGA SOM.

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