Agilex 5 SoC FPGA SOM

On Module Feature:

Agilex 5 SoC	Compatible E-Series B32A Package Family Group A: A5E 065A/052A/043A/028A/013A SoC FPGA Group B: A5E 065B/052B/043B/028B/013B/008B SoC FPGA Hard Processing System (HPS) Dual core Arm Cortex-A76 up to 1.4 GHz Dual core Arm Cortex-A55 up to 1.25 GHz Field Programmable Gate Array (FPGA) Up to 656,080 Logic elements 24 x transceivers up to 28Gbps 32Bit 4GB LDDR4 for HPS 2 x 32Bit 4GB LDDR4 for FPGA 32GB eMMC (Expandable) 1Gb QSPI Configuration flash 2.5G Ethernet PHY Transceiver USB2.0 ULPI Transceiver

Agilex 5 SoC

Compatible E-Series B32A Package Family
- Group A: A5E 065A/052A/043A/028A/013A SoC FPGA
- Group B: A5E 065B/052B/043B/028B/013B/008B SoC FPGA
Hard Processing System (HPS)
- Dual core Arm Cortex-A76 up to 1.4 GHz
- Dual core Arm Cortex-A55 up to 1.25 GHz
Field Programmable Gate Array (FPGA)
- Up to 656,080 Logic elements
- 24 x transceivers up to 28Gbps
32Bit 4GB LDDR4 for HPS
2 x 32Bit 4GB LDDR4 for FPGA
32GB eMMC (Expandable)
1Gb QSPI Configuration flash
2.5G Ethernet PHY Transceiver
USB2.0 ULPI Transceiver

Board to Board Connectors Interfaces:

From HPS (Hard Processor System)	RGMII x 1 USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver) Debug UART x 1 SD x 1 (Optional) I2C x 1 Data UART x 1
From SDM (Secure Device Manager)	JTAG x 1 AS x 1 (Active Serial x4)
From HPS to FPGA	2.5G Ethernet x 1 (through On-SOM Ethernet PHY) USB 3.0 x 1 SPI x 1 (With 2 Chip select) I2C x 1
From FPGA	24 x transceivers up to 28Gbps FPGA HSIO (Up to 48LVDS/96SE) FPGA HVIO (Up to 100)

General Features:

Power Input	5V through B2B Connector
Form Factor	60mm x 70mm
BSP Support	Linux BSP for ARM Cortex CPU
Operating Temperature	-40°C to +85°C
Environment Specification	RoHS & REACH Compliant

DEVELOPMENT KIT

2.5G Ethernet RJ45 MagJack
Gigabit Ethernet RJ45 MagJack
Micro SD Connector
TypeC USB connector for Debug
JTAG Connector
20-Pin PS Header (UART, SPI, GPIOs)
PCIe Gen4 x4
USB3.0 + USB2.0 through TypeC
DP(2 lane)
FMC+ Connector
PMOD Connector
QSFP+ Connector
HDMI OUT/IN
SDI IN/OUT

Need help with your FPGA and Product Design?

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink solution for Agilex 5 SoC FPGA SOM.

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards/SBC

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

Agilex 5 SoC FPGA SOM

On Module Feature:

Board to Board Connectors Interfaces:

General Features:

DEVELOPMENT KIT

Need help with your FPGA and Product Design?

THERMAL SOLUTIONS

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