The Need for Thermal Management in Embedded Boards and Solutions

• Hear Sinks and cooling fans

A large-surfaced thermally conductive metallic part acts as a passive heat exchanger, dissipating heat to the surrounding air via conduction, with the possibility to add cooling fans to heat sinks to aid in the removal of heat faster and more effectively.

• Heat pipes integration

Heat pipes are cooling devices used in high-temperature applications. A typical heat pipe consists of a fluid that absorbs heat, vaporizes, and travels along the pipe. At the condenser end, the vapor turns back to liquid form, and the cycle repeats.

• Heat spreaders

A heat spreader has a large flat surface on top that is usually pressed directly against another large flat surface. It allows heat transfer from a smaller spreader to a larger metal surface. Heat spreaders are ideal for devices that withstand extreme shocks and vibrations or inside sealed containers. Heat spreaders are perfect for devices subjected to shock and vibration or systems that must remain sealed within an enclosure.

• Thermodynamic coolers (TECs)

A thermodynamic cooler is ideal for systems where the component temperature has to be kept constant. Processors with high power dissipation use a combination of TECs, air cooling, and liquid cooling to extend the conventional air-cooling limits.

• Thermal vias

Thermal via arrays are incorporated over the copper-filled areas and placed close to the power source. In this method, the heat flows from components to the copper area, dissipating through the air from the vias. Thermal via arrays are often used in power management modules and components with thermal pads.

• Liquid cooling systems

Because liquids can transfer heat four times faster than air, they enable higher thermal performance in a smaller solution. A liquid cooling system includes a cold plate or cooled enclosure to interface with the heat source or device, a pump or a compressor to circulate the liquid through the system, and a heat exchanger to absorb the heat from the device and dissipate it safely.

Thermal Solutions from iWave

With an expert team of mechanical engineers, iWave designs heat sinks, fan sinks, and enclosures that fit the specific thermal characteristics of the product. Thermal simulation software is used to help engineers determine the most appropriate cooling method for their circuits and understand the thermal parameters associated with them to improve overall product reliability. It assists the designer in determining the following aspects,

• Heat flow pattern
• Heat sink design
• Cooling methods for active devices

iWave uses Ansys Icepak cooling simulation software to identify thermal hotspots and to provide the best recovery solution. Based on the total surface area identified in the design software, theoretical heat dissipation values are calculated, followed by testing the board in Ansys Icepak software to understand how the product behaves at various operating temperatures and to collect the junction temperature data. Finally, the best heat dissipation technique is designed to suit the product.