Versal AI Edge/Prime SOM

Versal AI Edge/Prime SOM

iW-RainboW-G57M®

  • Xilinx Versal AI Edge/Prime with SFVA784 package
    • Compatible with VE2302/2202/2102/2002/VM1102 devices
    • Dual ARM Cortex-A72 core processor of 1.6GHz speed
    • Up to 328K Logic cells & 150K LUTs
    • High AI Performance
  •  64bit, 4GB LPDDR4 (Expandable)
  • 16GB eMMC Flash and 256MB QSPI Flash
  • 8 channels of GTYP transceivers up to 32Gbps
  • Two 240pin High Speed B2B Connectors
  • Industrial Grade Availability
  • 10+ Years long term support

On Module Features:

Versal SoC
  • Xilinx Versal AI Edge/Prime SFVA784 package
  • Dual ARM Cortex-A72 core processor
  • Dual Core ARM Cortex-R5F
  • Up to 328K/150K Logic Cells
  • GTYP Transceivers x 8 @32Gbps
  • 39LVDS Pairs and 20SE PL IOs
PMIC
  • Dialog’s DA9062 PMIC with RTC
Clock
  • Clock Synthesizer
Memory Interfaces
  • 64-bit LPDDR4 from PL
  • 256MB QSPI Flash
  • 16GB eMMC Flash
Other Features
  • 10/100/1000 Ethernet PHY
  • USB2.0 Transceiver PHY
  • FAN Header

Board to Board Connector1 Interfaces(240pin):

From PL Block
  • 27LVDS/54SE IOs from BANK 703
  • 12LVDS/24SE IOs from BANK 702
  • 20SE IOs from BANK 302

Board to Board Connector2 Interfaces(240pin):

From PL Block
  • 8 x GTY High Speed Transceivers (up to 32Gbps)
From PS Block
  • GEM1 RGMII x 1
  • USB2.0 x 1
  • SD1 x 1
  • Debug UART x 1
  • PMC I2C x 1
  • Debug UART
  • SPI1(3CS) x 1
  • CAN FD x 1
  • JTAG

OS Support

Petalinux 2023.1

General Features:

Power Input

5V through B2B Connector2

Form Factor

50mm x 60mm

Operating Temperature

-40°C to +85°C (Industrial Grade)

Environment Specification

REACH & RoHS3 Compliant

Compliance

CE*

DEVELOPMENT KIT

  • FMC+ High Serial Pin Count (HSPC) Connector
  • 4K HDMI 2.0 IN and OUT through HDMI Connector
  • 12G SDI Video IN and OUT through HD BNC Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB Type-C for JTAG and PS Debug port
  • USB 2.0 Interface through USB Type C Connector
  • Micro SD
  • PMOD Connector
  • 60 Pin GPIO Header (For PS IOs)
  • Operating Temperature: -20°C to +85°C
  • Form Factor : 120mm x 120mm

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader.

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