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TI OSM TOp view image

TI AM62Ax Based OSM-LF Module

TI AM62Ax Based OSM-LF Module

iW-RainboW-G55M®

  • AM62Ax with 64-Bit Quad Arm Cortex-A53
  • Dual core ARM Cortex-R5F Subsystem
  • 2GB LPDDR4 Expandable up to 8GB and 16GB eMMC Flash
  • C7xV-256 Deep Learning Accelerator (2 TOPS)
  • Supports Low power mode by Device Manager
  • IEEE 802.11 a/b/g/n/ac/ax Wi-Fi 6 + BT 5.3 + IEEE 802.15.4
  • AEC-Q104*
  • OSM v1.1 Size-LF LGA Solderable Module
Categories: ,

On Module Feature:

CPU

4 x Arm Cortex-A53@1.4GHz
1 x Arm Cortex-R5F (Integrated as part of MCU Channel with FFI) @800MHz
1 x Arm Cortex-R5F (Integrated to support Device Management) @800MHz

Memory

2GB LPDDR4 expandable up to 8GB
16GB eMMC Flash expandable up to 128GB
16Mb QSPI Flash

Other

IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4

OSM BGA Features:

Main Domain

  • RGMII x 2 Port
  • USB2.0 x 2 Port
  • SD(4-Bit) x 1
  • MIPI CSI x 1(4 Lane)
  • RGB-18 bit
  • CAN x 1 Port
  • I2C x 2 Port
  • QSPI x 1 Port (With CS1)
  • Audio x 1 Port
  • UART x 2 Port
  • Debug UART x 1 Port
  • JTAG x 1 Port
  • GPIO x 3
  • PWM x 2
  • Boot Mode

MCU Domain

  • MCU_MCAN x 1
  • MCU_I2C x 1
  • MCU_SPI x 1 (With 2 chip selects)
  • MCU_UART x 1
  • WKUP_UART x 1
  • MCU_GPIO x 8

OS Support:

  • Linux 6.1.46
  • Free RTOS

General Features:

Power Input

5V, 2.5A through OSM BGA

Form Factor

45mm x 45mm

Operating Temperature

-40°C to +85°C (AEC-Grade 3)

Environment Specification

REACH & RoHS3 Compliant

TI AM62Ax OSM BASED SBC

TI Compact SBC - Top view
TI Compact SBC - Bottom view
TI Compact SBC - Side angle
  • AM62Ax with 64-Bit Quad ARM Cortex® A53 & Dual core ARM Cortex®-R5F Subsystem
  • 2GB LPDDR4 memory and 16GB eMMC Flash
  • 16Mb QSPI NOR Flash
  • C7xV-256 Deep Learning Accelerator (up to 2 TOPS)
  • IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4
  • Gigabit Ethernet Jack x 1
  • USB2.0 OTG Micro-B Conn x 1
  • USB2.0 Header x 1
  • Debug UART Connector x 1
  • RTC Battery Connector x 1
  • Expansion Connector x 3 with support for:
  • RGMII, UART, SPI, CAN, PWM, I2S, I2C, JTAG & GPIOs
  • Compact Form Factor of 85mm x 56mm
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EXPLORE

THERMAL SOLUTIONS

Top view of heat sink for i.MX 8M plus
Bottom view of heat sink for i.MX 8M plus
Top view of heat sink spreader for i.MX 8M plus
Bottom view of heat sink spreader for i.MX 8M plus

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for TI AM62Ax OSM LGA Module.

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ENCLOSURE

Enclosure for i.MX 8M Plus Pico ITX SBC

The Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

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RELATED VIDEOS

Object Detection and Tracking AI Demo on TI AM62Ax System on Module from iWave

Product Design with the OSM Standard SOM (Solderable System on Module)

iWave Portfolio of OSM Solderable System on Modules & Single Board Computers

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