TI AM62Ax Based OSM-LF Module

TI AM62Ax Based OSM-LF Module

iW-RainboW-G55M®

  • AM62Ax with 64-Bit Quad Arm Cortex-A53
  • Dual core ARM Cortex-R5F Subsystem
  • 2GB LPDDR4 Expandable up to 8GB and 16GB eMMC Flash
  • C7xV-256 Deep Learning Accelerator (2 TOPS)
  • Supports Low power mode by Device Manager
  • IEEE 802.11 a/b/g/n/ac/ax Wi-Fi 6 + BT 5.3 + IEEE 802.15.4
  • AEC-Q104*
  • OSM v1.1 Size-LF LGA Solderable Module

On Module Feature:

CPU

4 x Arm Cortex-A53@1.4GHz
1 x Arm Cortex-R5F (Integrated as part of MCU Channel with FFI) @800MHz
1 x Arm Cortex-R5F (Integrated to support Device Management) @800MHz

Memory

2GB LPDDR4 expandable up to 8GB
16GB eMMC Flash expandable up to 128GB
16Mb QSPI Flash

Other

IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4

OSM BGA Features:

Main Domain

  • RGMII x 2 Port
  • USB2.0 x 2 Port
  • SD(4-Bit) x 1
  • MIPI CSI x 1(4 Lane)
  • RGB-18 bit
  • CAN x 1 Port
  • I2C x 2 Port
  • QSPI x 1 Port (With CS1)
  • Audio x 1 Port
  • UART x 2 Port
  • Debug UART x 1 Port
  • JTAG x 1 Port
  • GPIO x 3
  • PWM x 2
  • Boot Mode

MCU Domain

  • MCU_MCAN x 1
  • MCU_I2C x 1
  • MCU_SPI x 1 (With 2 chip selects)
  • MCU_UART x 1
  • WKUP_UART x 1
  • MCU_GPIO x 8

OS Support:

  • Linux 6.1.46
  • Free RTOS

General Features:

Power Input

5V, 2.5A through OSM BGA

Form Factor

45mm x 45mm

Operating Temperature

-40°C to +85°C (AEC-Grade 3)

Environment Specification

REACH & RoHS3 Compliant

TI AM62Ax OSM BASED SBC

  • AM62Ax with 64-Bit Quad ARM Cortex® A53 & Dual core ARM Cortex®-R5F Subsystem
  • 2GB LPDDR4 memory and 16GB eMMC Flash
  • 16Mb QSPI NOR Flash
  • C7xV-256 Deep Learning Accelerator (up to 2 TOPS)
  • IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4
  • Gigabit Ethernet Jack x 1
  • USB2.0 OTG Micro-B Conn x 1
  • USB2.0 Header x 1
  • Debug UART Connector x 1
  • RTC Battery Connector x 1
  • Expansion Connector x 3 with support for:
  • RGMII, UART, SPI, CAN, PWM, I2S, I2C, JTAG & GPIOs
  • Compact Form Factor of 85mm x 56mm

THERMAL SOLUTIONS

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for TI AM62Ax OSM LGA Module.

ENCLOSURE

The Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

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