Renesas RZ/G2L SBC

Renesas RZ/G2L SBC

iW-RainboW-G56S®

  • Renesas RZ/G2L MPU with 64-bit ARM®v8.2A, ARM®v8-M & 3D-Graphics Engine with Arm®Mali™ Architecture
  • Supports dual Cortex-A55 & Single Cortex-M33
  • Up to 2GB DDR4 Memory
  • Supports 1 × 1Gb Ethernet
  • 10+ years of Product Longevity Program
  • Compact Form Factor of 85mm x 56mm

On Module Feature

CPU
  • RZ/G2L:
    • 2 x Arm®Cortex-A55@1.2GHz
    • 1 x Arm®Cortex-M33@200MHz
    • 1 x Arm®Mali™-G31@500MHz
Memory & Storage
  • DDR4 – 2GB (Expandable)*
  • eMMC NAND Flash – 16GB (Expandable)
  • QSPI Flash – 256Mb/Octa-SPI Flash – 512Mb (Optional)
  • Micro SD slot
  • EEPROM – 32Kb

Network & Communication

  • Gigabit Ethernet x 1 (Single RJ45 Mag-jack Connector)
  • USB 2.0 OTG (micro–AB Receptacle Connector)
  • USB 2.0 Header x 1

Video Features

  • MIPI CSI Interface (4 Lane) x 1
  • RGB Display Interface (18-bit) x 1

Miscellaneous Interfaces

  • Debug UART Connector
  • RTC Connector

Expansion Connector Features

  • 1 x RGMII
  • 2 x UART (without flow control)
  • 2 x UART (with flow control)
  • 2 x CAN
  • 2 x SPI
  • 1 x I2C
  • 1 x PWM
  • 2 x ADC
  • 1 x JTAG
  • 1 x MIPI DSI (4-lane)
  • GPIOs

OS Support

  • Linux 5.10.201 (or higher)

General Features

Power Input

12V

Form Factor

85mm X 56mm

Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

REACH & RoHS3 Compliant

*Based on chip availability

OSM LGA MODULE

  • Renesas RZ/G2L MPU with 64-bit ARM®v8.2A, ARM®v8-M & 3D-Graphics Engine with Arm®Mali™ Architecture
  • Supports dual Cortex-A55 & Single Cortex-M33
  • Up to 4GB DDR4 Memory
  • Supports 2 × RGMII
  • OSM v1.1 Size-LF LGA Module

RELATED VIDEOS

Copyright © 2022 iWave Systems Technologies Pvt. Ltd.