Agilex 7 SoC FPGA SOM

On Module Feature:

Agilex 7 R31B/C SoC FPGA	Compatible R31B/C Package Family Compatible Agilex 7 I-Series – Agilex AGI 019, AGI 023, AGI 022, AGI 027 Compatible Agilex 7 F-Series – Agilex AGF 019, AGF 023, AGF 022, AGF 027 Hard Processing System (HPS) Quad-core 64-bit Arm Cortex-A53 up to 1.50 GHz Field Programmable Gate Array (FPGA) Up to 2,692,760 Logic elements 8 x FHT transceivers up to 116Gbps (Only in R31B) 64 x FGT transceivers up to 58Gbps 8GB DDR4 with ECC for HPS (64bit + 8bit) 2 x 8GB DDR4 with ECC for FPGA (64bit + 8bit) On SOM PTP & SyncE Network Synchronizers 32GB eMMC (Expandable) RGMII Ethernet PHY Transceiver USB2.0 ULPI Transceiver

Agilex 7 R31B/C SoC FPGA

Compatible R31B/C Package Family

- Compatible Agilex 7 I-Series – Agilex AGI 019, AGI 023, AGI 022, AGI 027
- Compatible Agilex 7 F-Series – Agilex AGF 019, AGF 023, AGF 022, AGF 027
Hard Processing System (HPS)

- Quad-core 64-bit Arm Cortex-A53 up to 1.50 GHz
Field Programmable Gate Array (FPGA)
- Up to 2,692,760 Logic elements
- 8 x FHT transceivers up to 116Gbps (Only in R31B)
- 64 x FGT transceivers up to 58Gbps
8GB DDR4 with ECC for HPS (64bit + 8bit)
2 x 8GB DDR4 with ECC for FPGA (64bit + 8bit)
On SOM PTP & SyncE Network Synchronizers
32GB eMMC (Expandable)
RGMII Ethernet PHY Transceiver
USB2.0 ULPI Transceiver

Board to Board Connectors Interfaces:

From HPS (Hard Processor System)	Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY) USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver) Debug UART x 1 SD x 1 (Optional) I2C x 1 Data UART x 1
From SDM (Secure Device Manager)	JTAG x 1
From HPS to FPGA	SPI x 1 I2C x 1
From FPGA	8 x FHT transceivers up to 116Gbps 64 x FGT transceivers up to 58Gbps FPGA IOs (Up to 126LVDS/252SE)

General Features:

Power Input	12V through B2B Connector
Form Factor	120mm x 90mm
BSP Support	Linux BSP for ARM Cortex CPU
Operating Temperature	-40°C to +85°C
Environment Specification	RoHS & REACH Compliant

DEVELOPMENT KIT

QSFP Connector x 4 (2 x 400G, 1 x 200G & 1 x 100G)
FMC+ High Pin count(HPC) connector x 3 (3rd FMC+ supports only DIFF/SE IOs)
PCIe Gen4 x16 Connector x 1
4K HDMI 2.0 IN & OUT through HDMI Connector
SDI Video IN & OUT through HD BNC Connector
PMOD Connectors x 1
Gigabit Ethernet through RJ45MagJack x 1
USB2.0 OTG through Type C connector x 1
Debug UART through Type C connector x 1
20 Pin Header (for HPS IOs)
Micro SD Connector x 1
JTAG Connector x 1
Operating Temperature: -0°C to +85°C
Form Factor : 160mm x 210mm

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

Product Design Process

Certification & Qualification

Product Lifecycle Management

Mechanical Services

THERMAL SOLUTIONS

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Fan Sink solution for Agilex 7 SoC FPGA SOM.

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

Agilex 7 SoC FPGA SOM

On Module Feature:

Board to Board Connectors Interfaces:

General Features:

DEVELOPMENT KIT

Custom Design Sevices

THERMAL SOLUTIONS

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