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RZ/G1H – Qseven SOM

RZ/G1H – Qseven SOM

iW-RainboW-G21M®

  • Quad ARM Cortex®-A15 MPCore® @1.4GHz
  • Quad ARM Cortex®-A7 MPCore® @780MHz
  • Audio & Video Interfaces
  • Video Codec module
  • 3D Graphics Engine
  • Qseven standard compatibility
  • JSS-55555 Environmental test certified
  • Industrial Grade
Categories: ,

On Module Features

  • Renesas’s RZ/G1H CPU:
    • Quad ARM Cortex®-A15 MPCore® @ 1.4GHz
    • Quad ARM Cortex®-A7 MPCore® @ 780MHz
  • DDR3 SDRAM – 2GB (Expandable)
  • SPI Flash – 2MB (Expandable)
  • eMMC Flash – 8GB (Expandable)
  • Gigabit Ethernet PHY Transceiver
  • 10/100M Ethernet PHY Transceiver
  • USB 2.0 High Speed 2-Port Hub
  • HDMI Transmitter (Optional)
  • RTC controller
  • JTAG Header
  • SPI Programming Header

Qseven PCB Edge Interfaces

  • Gigabit Ethernet x 1 (through On-SOM Gigabit Ethernet PHY transceiver)
  • USB3.0 Host x 1
  • USB 2.0 OTG x 1
  • USB 2.0 Host x 1
  • USB 2.0 Host x 2 (through On-SOM USB 2.0 High Speed 2-port Hub)
  • PCIe5 x 1
  • SATA x 1 (Optional)
  • SD (4bit) x 1
  • LVDS x 2
  • HDMI x 1
  • SSI/I2S (Audio Interface) x 1
  • Debug UART x 1
  • Data UART (with CTS & RTS) x 1
  • CAN x 1
  • SPI x 1 (with 2 Chip selects)
  • I2C x 3
  • PWM x 3
  • GPIO’s x 8

Expansion Connector1 Interfaces

  • VIN0 – 8bit/16bit
  • VIN1 – 8bit/16bit
  • VIN2 – 8bit
  • VIN3 – 8bit

Expansion Connector2 Interfaces

  • 10/100 Ethernet x 1 (through On-SOM Ethernet PHY transceiver)
  • SSI/I2S x 1
  • Data UART x 3
  • CAN x 1
  • SPI x 1
  • PWM x 3

OS Support

Linux 3.10.31

General Features:

Power Input

5V

Operating Temperature

-40°C to +85°C

Form Factor

70mm x 70mm

Environment Specification

RoHS & REACH Compliant

DEVELOPMENT KIT

2 (2)
1 (1)
  • PCIe x 1 Connector
  • USB 3.0/USB 2.0 Host
  • SATA x 1 22pin Serial ATA Connector (Optional)1
  • 100/1000Mbps Ethernet x 1 through RJ45MagJack
  • 7” RGB LCD with Capacitive Touch
  • I2S Audio Codec x 1 with 3.5mm Audio IN and OUT jack
  • USB 2.0 Host through Type A Connector
  • USB 2.0 Host through Dual Stack USB3.0 Type A Connector
  • USB 2.0 OTG through Micro AB Connector
  • Standard SD Connector
  • CAN Header
  • RTC Coin Cell holder
  • Operating Temperature: 0°C to +60°C
  • Form Factor : 120mm x 120mm
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BROCHURE

THERMAL SOLUTIONS

Heatsink (1)
Heatspreader

For any highly integrated System On Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader Solution for RZ/G1H Qseven SOM.

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