Agilex 3 SoC FPGA SOM

On Module Feature:

Agilex 3 SoC FPGA	Compatible C-Series M16A Package Family Group C: A3C 100/A3C 135 Hard Processing System (HPS) Dual-core Arm Cortex-A55 up to 800 MHz Field Programmable Gate Array (FPGA) Up to 1,35,000 Logic elements 4 x GTS transceivers up to 12.5Gbps
Memory Interfaces	HPS LPDDR4 – 32bit 4GB (Expandable up to 8GB) 32GB eMMC (Expandable up to 128GB) 1Gb QSPI Flash (Expandable up to 2Gb)
Other On SOM Features	2.5G Ethernet PHY Transceiver USB2.0 ULPI Transceiver Clock Synthesizer JTAG Header FAN Header

Board to Board Connector1 Interfaces(240pin)

From FPGA	4 x GTS transceivers up to 12.5Gbps FPGA HSIO 60 pair/120SE IOs and 38 HVIOs

Board to Board Connector2 Interfaces(240pin)

From HPS (Hard Processor System)	RGMII x 1 USB2.0 OTG x 1 (through On-SOM USB2.0 transceiver) Debug UART x 1 I2C x 1 Data UART x 1 SD x 1 (Optional)
From SDM (Secure Device Manager)	JTAG x 1 AS x 1 (Active Serial x4)
From HPS to FPGA	2.5G Ethernet x 1 (through On-SOM Ethernet PHY) USB 3.0 x 1 I2C x 1

General Features:

Power Input	5V through B2B Connector
Form Factor	50mm x 60mm(REN)
BSP Support	Linux BSP for ARM Cortex CPU
Operating Temperature	-40°C to +85°C
Environment Specification	RoHS & REACH Compliant

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

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Agilex 3 SoC FPGA SOM

On Module Feature:

Board to Board Connector1 Interfaces(240pin)

Board to Board Connector2 Interfaces(240pin)

General Features:

Custom Design Sevices

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