ZU15/ZU9/ZU6- Zynq UltraScale+ MPSoC System on Module

ZU15/ZU9/ZU6- Zynq UltraScale+ MPSoC System on Module

iW-RainboW-G65M®

  • AMD Xilinx’s ZU15/9/6 Compatible Zynq Ultrascale+ MPSoC SOM
  • 64bit, 4GB PS DDR4 RAM with ECC (Upgradable)
  • 16 bit, 1GB PL DDR4 RAM (Upgradable)
  • 16 High-Speed Transceiver lanes (Up to 16.3Gb/s)
  • 4 PS GTR Transceiver Lanes (Up to 6Gb/s)
  • 8GB eMMC Flash (Upgradable)
  • On-SOM Gigabit Ethernet PHY & USB2.0 transceiver
  • RGMII Interface or ULPI Interface x 1

On Board Features:

ZU15EG ZU9/6 EG/CG - Zynq Ultrascale+ MPSoC (FFVC900)

Processing System (PS/Processor)

  • Quad-core ARM Cortex-A53 MPCore @1.5GHz
  • Dual-core ARM Cortex-R5 MPCore @600MHz
  • Arm Mali-400MP2 GPU

Programming Logic (PL/FPGA)

  • Upto 747K Logic cells & 341K LUTs
  • High Speed GTH Transceivers x 16 (Upto 16.3Gb/s)

 

RAM Memory
  • PS: 64bit, 4GB DDR4 RAM with ECC (Expandable upto 8GB)
  • PL/FPGA: 16bit, 1GB DDR4 RAM (Expandable upto 2GB)
On Board Flash
  • 8GB eMMC Flash for boot & storage (expandable up to 128GB)
  • EEPROM (4Kbit)

     

Other Interfaces
  • Gigabit Ethernet PHY Transceiver (PTP supported)
  • USB2.0 PHY Transceiver
  • 6 Output programable clock synthesizer

240pin High-Speed Board to Board Connector 1 Interfaces

From PS Block
  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • GEM3 RGMII Interface or ULPI Interface x 1
  • CAN interface x2
From PL Block
  • High Speed GTH Transceiver Lanes x 12 (Up to 16.3Gbps)
  • HD Bank IOs – Up to 23LVDS/46 Single Ended IO’s
  • ADC Input pins- Up to 20 Differential/Single Ended from HD Banks

240pin High-Speed Board to Board Connector 2 Interfaces

From PS Block
  • PS GTR Transceiver Lanes x 2 (Up to 6.0Gb/s)
  • Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY)
  • USB2.0 OTG x 1 Port (through On-SOM USB2.0 transceiver)
  • SD (4bit) x 1
  • Debug UART & Data UART x 1
  • SPI x 1
  • I2C x 2 Port
  • JTAG x 1
From PL Block
  • High Speed GTH Transceiver Lanes x 4 (Up to 16.3Gbps)
  • HP Bank IOs – 48 LVDS/96 Single Ended IO’s
  • ADC Input pins – Up to 32 Differential/Single Ended from HP Banks

General Specification

Power Supply

+5VDC +/- 5% input from Board-to-Board Connector 2

Form Factor

95mm X 75mm

Environment Specification

RoHS & REACH Compliant

Compliance

CE*

Notes:
*Under Progress

DEVELOPMENT KIT

ZU15EG ZU9/6 EG/CG Devkit image
  • 10G Ethernet through SFP+ Connector
  • 3G SDI Video IN through HD BNC Connector
  • 3G SDI Video OUT through HD BNC Connector
  • Dual FMC High Pin Count (HPC) Connector
  • DP1.2a Display Port Connector
  • PCIe Gen2 x4 Connector
  • M.2 SATA 3.1 Connector
  • Dual Gigabit Ethernet through RJ45MagJack
  • USB2.0 OTG through Micro-AB Connector
  • USB 2.0 OTG through TypeC Connector
  • USB 3.0 through TypeC connector
  • Standard SD Connector
  • CAN Header
  • Dual PMOD Connector
  • JTAG Header
  • RTC Coin Cell Holder
  • Operating Temperature: -20°C to +85°C
  • Form Factor: 130mm x 140mm

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