TI DRA821Ux Based OSM System on Module

TI DRA821Ux Based OSM System on Module

iW-RainboW-G59M®

  • DRA821U with 64-bit Dual Arm Cortex-A72
  • 4× Arm Cortex-R5F Subsystem
  • 2GB LPDDR4 Expandable up to 8GB and 16GB eMMC Flash
  • OSM-MF (OSM™ module with Size-M “Medium” and Height “Flat”)

On Module Feature

CPU
  • Dual Arm Cortex-A72@2GHz
  • 2× Arm® Cortex®-R5F (Integrated as part of MCU subsystem) @1GHz
  • 2× Arm® Cortex®-R5F (Integrated as part of general compute partition) @1GHz
Memory
  • 2GB LPDDR4 expandable up to 8GB
  • 16GB eMMC Flash
  • 2KB EEPROM

OSM BGA Features

  • High speed Interface: 4x SerDes (PCIe, SGMII, USB3.0)
  • 3x RGMII
  • 1x USB2.0 Port
  • SD(4-bit)
  • 2x CAN ports
  • 2x I2C
  • 2x MCASP
  • 3x SPI
  • 4x UART
  • 1 x Debug UART
  • 2x ADC
  • JTAG
  • GPIOs

OS Support

  • Linux

General Features

Power Input

5V, 4.5A through OSM BGA

Form Factor

45mm x 30mm

Operating Temperature

-40°C to +85°C

Environment Specification

REACH & RoHS3 Compliant

TI DRA821Ux BASED SBC

  • DRA821Ux with 64-bit Dual Arm Cortex-A72
  • 4× Arm Cortex-R5F Subsystem
  • 2GB LPDDR4 memory and 16GB eMMC Flash
  • Micro SD slot
  • Gigabit Ethernet Jack x2
  • Supports Super Speed USB 3.0
  • USB 2.0 through Micro AB connector
  • Audio IN/OUT through 3.5mm Audio Jack
  • Data UART through RS232 Header x1
  • CAN Interface through CAN Header x1
  • Debug UART Header x1
  • RTC Battery Connector x1
  • Expansion Connector with support for: ADC x2, GPIOs x10
  • Compact Form Factor of 100mm x 72mm

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