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TI AM62Ax based SBC

TI AM62Ax based SBC

iW-RainboW-G55S®

  • AM62Ax with 64-Bit Quad ARM Cortex® A53 & Dual core ARM Cortex®-R5F Subsystem
  • 2GB LPDDR4 memory and 16GB eMMC Flash
  • C7xV-256 Deep Learning Accelerator (up to 2 TOPS)
  • Supports Low power mode by Device Manager
  • IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4
  • 1000/100/10 Mbps Ethernet
Categories: ,

CPU

  • AM62A74 Quad Core: 4 x Cortex-A53, 2 x Cortex-R5F, 1 x C7x DSP, VPU & ISP, up to 2 TOPS
  • AM62A72 Dual Core: 2 x Cortex-A53, 2 x Cortex-R5F, 1 x C7x DSP, VPU & ISP, up to 2 TOPS
  • AM62A34 Quad core: 4 x Cortex-A53, 2 x Cortex-R5F, 1 x C7x DSP, VPU & ISP, up to 1 TOPS
  • AM62A32 Dual core: 2 x Cortex-A53, 2 x Cortex-R5F, 1 x C7x DSP, VPU & ISP, up to 1 TOPS
  • AM62A31 Single core: 1 x Cortex-A53, 2 x Cortex-R5F, 1 x C7x DSP, VPU & ISP, up to 1 TOPS
  • 1x Arm® Cortex®-R5F (Integrated as part of MCU Channel with FFI) @ 800MHz
  • 1x Arm® Cortex®-R5F (Integrated to support Device Management) @ 800MHz

Memory & Storage

  • 2GB LPDDR4(Expandable up to 8GB)
  • 16GB eMMC Flash (Expandable up to 128GB)
  • Micro SD Slot
  • 16Mb QSPI Flash

Network & Communication

  • IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4
  • Gigabit Ethernet PHY Transceiver with RJ45 Magjack Connector
  • USB 2.0 (USB 3.0 stack top port)
  • USB 2.0 OTG port through – micro AB Receptacle Connector
  • USB 2.0 Header x 1

Video Features

  • 36pin MIPI_CSI Camera Connector
  • 50pin RGB Display Connector with Touch

Miscellaneous Interfaces

  • Debug UART Connector
  • RTC Connector

Expansion Connector Features

Expansion Connector1 Interfaces
  • UART x 4 Port (1 With CTS & RTS)
  • PWM x 1 Port
  • GPIO x 4
  • RGMII_Tx
Expansion Connector2 Interfaces
  • MCU_SPI x 1(CS_1)
  • MCU_CAN x 1 Port
  • I2S x 1
Expansion Connector3 Interfaces
  • QSPI x 1(CS_1)
  • CAN x 1 Port
  • I2C x 1 Port
  • JTAG x 1
  • I2S x 1
  • RGMII_Rx

OS Support

  • Linux 6.1.46
  • Free RTOS

General Specification

Power Input

7V to 24V (Default 12V)

Form Factor

85mm x 56mm

Operating Temperature

-40°C to +85°C (Industrial)

Environment Specification

REACH & RoHS3 Compliant

OSM LGA MODULE

TI Topview
TI Bottom view
  • AM62Ax with 64-Bit Quad Arm Cortex-A53
  • Dual core ARM Cortex-R5F Subsystem
  • 2GB LPDDR4 Expandable up to 8GB and 16GB eMMC Flash
  • C7xV-256 Deep Learning Accelerator (2 TOPS)
  • Supports Low power mode by Device Manager
  • IEEE 802.11 a/b/g/n/ac/ax Wi-Fi + BT 5.3 + IEEE 802.15.4
  • AEC-Q104*
  • OSM v1.1 Size-LF LGA Solderable Module
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EXPLORE

THERMAL SOLUTIONS

Top view of heat sink for i.MX 8M plus
Bottom view of heat sink for i.MX 8M plus
Top view of heat sink spreader for i.MX 8M plus
Bottom view of heat sink spreader for i.MX 8M plus

For any highly integrated Single Board Computer, thermal design is very important factor. iWave Supports Heat Sink and Fan Sink Solution for AM62Ax Compact SBC.

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ENCLOSURE

Enclosure for i.MX 8M Plus Pico ITX SBC

The Enclosure is essential for a SBC, iWave provides rugged Aluminum and metal enclosure options which keeps the device safe whilst maintaining full access to all the major ports.

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RELATED VIDEOS

Object Detection and Tracking AI Demo on TI AM62Ax System on Module from iWave

Product Design with the OSM Standard SOM (Solderable System on Module)

iWave Portfolio of OSM Solderable System on Modules & Single Board Computers

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