Zynq UltraScale+ RFSoC SOM

iW-RainboW-G42M^®

Zynq Ultrascale+ RFSoC family with FFVF1760 Package
- Compatible with ZU49/ZU39/ZU29DR device
Dual 400 Pin Board to Board connectors with
- 16 ADC Channels support up to 2.5Gsps
- 16 DAC Channels support up to 10Gsps
- 16 GTY Transceivers support up to 28.21Gbps
- Up to 188 FPGA IOs
Integrated ultra low-noise programmable RF PLL
Integrated SyncE & PTP Network Synchronization
Industrial Grade Availability
10+ Years Longevity Support

Categories: FPGA Modules, System On Modules

On Module Features:

Zynq Ultrascale+ RFSoC	ZU49/ZU39/ZU29DR Processing System (PS) Quad Arm Cortex-A53 @1.3GHz, Dual Cortex-R5F @533MHz Programming Logic (PL) Up to 930 Logic cells & 425K LUTs PL GTY High Speed Transceivers x 16 @28.21 Gbps
Memory	64bit, 8GB DDR4 RAM with ECC for PS (Upgradable upto 34GB) 64bit, 8GB DDR4 RAM for PL 32GB eMMC Flash (Upgradable) 256MB QSPI Flash

Board to Board Connector1 Interfaces (400pin):

ADC	16 x ADC Channels up to 2.5Gsps
DAC	16 x DAC Channels up to 10Gsps
PL IOs	PL IOs – 188 IOs HP Bank IOs – up to 70LVDS/140SE HD Bank IOs – up to 24LVDS/48SE

ADC

16 x ADC Channels up to 2.5Gsps

DAC

16 x DAC Channels up to 10Gsps

PL IOs

PL IOs – 188 IOs

- HP Bank IOs – up to 70LVDS/140SE
- HD Bank IOs – up to 24LVDS/48SE

Board to Board Connector2 Interfaces (400pin):

From PL Block	16 x PL-GTY High Speed Transceivers (up to 28.21Gbps) PL Control Signal
From PS Block	Gigabit Ethernet x 1 Port (through On-SOM Gigabit Ethernet PHY) USB 2.0 OTG x 1 (through On-SOM USB2.0 transceiver) SPI/QSPI X 1 Port(Optional) CAN x 1 I2C x 2 SD x 1 Debug UART x 1 Data UART x 1 PS JTAG RGMII Interface or ULPI Interface x 1 PS -GTR High speed Transceivers x 4 (upto 6Gbps) PS-Control Signals SYSMON(Optional)
Clock signals	10MHz Clock IN 1 PPS IN 10 MHz Clock out 1 PPS Clock Out Synthesized Clock out from Clock synthesizer Synthesized Clock Into Clock Synthesizer

General Features:

Power Input	12V through B2B Connector2
Form Factor	100mm x 90mm(BRYN)
BSP Support	Linux BSP:- Petalinux/vivado 2022.1
Operating Temperature	-40°C to +85°C (Industrial Grade)
Environment Specification	REACH & RoHS3 Compliant
Compliance	CE*

DEVELOPMENT KIT

RF DAC/ADC Specifications:

8 RF RT SMA connectors with Balun(BW-800MHz-1GHz)
8 RF ST SMA connectors with Balun(BW-800MHz-1GHz)
8RF ST SMA connectors with Balun(BW-700MHz-1.6GHz)
8 RF ST SMA connectors with Balun(BW-10MHz-3GHz)

High Speed and Interface Specifications:

PCIe Gen3 x8 Edge Connector.
FMC+ High Pin count(HPC) connector
4 SMA Straight angled connector for Clocks(10Mhz, 1PPS, SYS-CLK IN/Out)
NVMe PCIe Gen2 x2 M.2 Connector
Gigabit Ethernet through RJ45MagJack
Debug & DATA UART/JTAG through Type-C Connector
Operating Temperature: -30°C to +85°C
Form Factor : 254mm x 111.15mm (3/4 Length PCIe Card)

Custom Design Sevices

iWave provides end-to-end ODM services, from concept to production, leveraging our in-house expertise in hardware design, software development, FPGA design, and mechanical enclosure design. The FPGA expertise at iWave includes RTL, high speed bus interface and transceivers, storage, video, networking, and high-speed ADC/DAC with the entire product lifecycle, from initial concept to mass production and ongoing support.

Product Design Process

Certification & Qualification

Product Lifecycle Management

Mechanical Services

THERMAL SOLUTIONS

For any highly integrated System on Modules, thermal design is very important factor. iWave Supports heat Spreader and Fan Sink solution for RFSoC based SOM.

AMD

INTEL

ACHRONIX

NXP

TI

ST

RENESAS

PCIe CARDS

VPX CARDS

FMC CARDS

PCIe Cards

VPX Cards

FMC Cards

Documents

Design Support

Software

Documents

Design Support

Software

Zynq UltraScale+ RFSoC SOM

Zynq UltraScale+ RFSoC SOM

On Module Features:

Board to Board Connector1 Interfaces (400pin):

Board to Board Connector2 Interfaces (400pin):

General Features:

DEVELOPMENT KIT

Custom Design Sevices

THERMAL SOLUTIONS

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