i.MX 8XLite OSM – SE LGA Module

i.MX 8XLite OSM – SE LGA Module

iW-RainboW-G46M®

  • i.MX 8XLite Dual/Solo Arm Cortex-A35 & Arm Cortex-M4F
  • 2GB LPDDR4 Memory and 8GB eMMC Flash
  • AEC-Q104*
  • Supports 1× 1Gb Ethernet with AVB
  • Supports 2× RGMII (1 with TSN)
  • 10+ years of Product Longevity Program
  • OSM v1.0 Size-SE LGA Solderable Module

On Module Feature:

CPU

i.MX 8XLite Dual: 2 x Cortex-A35, 1 x Cortex-M4F
i.MX 8XLite Solo: 1 x Cortex-A35, 1 x Cortex-M4F

Memory & Storage

2GB LPDDR4
8GB eMMC Flash expandable up to 16GB

OSM BGA Features:

  • RGMII x 2
  • USB 2.0 OTG x 1
  • USB 2.0 HOST x 1
  • PCIe3.0 x 1
  • CAN x 2
  • UART x 3 (1 is optional)
  • 18-bit RGB
  • I2S x 1
  • SPI x 1
  • I2C x 2
  • JTAG x 1
  • GPIOs

OS Support:

  • Linux 6.1.22

General Features:

Power Input

5V, 2.5A through OSM LGA

Form Factor

30mm x 30mm (Size S)

Operating Temperature

-40°C to +85°C (AEC-Grade 3)

Environment Specification

REACH & RoHS3 Compliant

Note: Optional features are not supported in default configuration

OSM Based Pico ITX SBC

  • Dual 1000/100/10 Mbps Ethernet
  • CAN Header x 1
  • USB 2.0 OTG (micro AB Receptacle Connetor) x 1
  • Debug UART Header x 1
  • USB2.0 Header x 1
  • Speaker Header
  • Audio In & Out Jack through I2S Codec x 1
  • RS232 Header x 1 (without CTS/RTS)
  • M.2 Connector Key B/M (Key M is optional)

Thermal Solutions

For any highly integrated OSM Modules, thermal design is very important factor. iWave Supports Heat Sink and Heat Spreader solution for i.MX 8XLite OSM LGA Module.

Enclosure

The Enclosure is essential for an SBC, iWave provides rugged Aluminum and metal enclosure options that keeps the device safe whilst maintaining full access to all the major ports.

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